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tp8 www.vishay.com vishay sprague revision: 11-may-16 1 document number: 40151 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 solid tantalum chip capacitors, m icro t an ? , high cv leadframeless molded automotive grade features ? highest capacitance-voltage product in industry in given case size ? small sizes include 0603 footprint ? lead (pb)-free l-shaped terminations ? aec-q200 qualified. ppap available upon request ? 8 mm tape and reel packaging available per eia-481 ? material categorization: ? for definitions of compliance please see www.vishay.com/doc?99912 performance/electrical characteristics www.vishay.com/doc?40215 operating temperature: -55 c to +125 c ? (above 85 c, voltage derating is required) capacitance range: 1.0 f to 100 f capacitance tolerance: 10 %, 20 % voltage rating: 6.3 v dc to 40 v dc note ? we reserve the right to supply higher voltage ratings and tighter capacitance tolerance capacitors in the same case size. ? voltage substitutions will be marked with the higher voltage rating. ordering information tp8 m 105 m 010 c type case code capacitance capacitance tolerance dc voltage rating at +85 c termination/ packaging see ratings and case codes table. this is expressed in picofarads. the first two digits are the significant figures. the third is the number of zeros to follow. k = 10 % m = 20 % this is expressed in v. to complete the three-digit block, zeros precede the voltage rating. a decimal point is indicated by an r (6r3 = 6.3 v). c = 100 % tin 7" [178 mm] reel dimensions in inches [millimeters] case code l w h (max.) p1 p2 (ref.) c m 0.063 0.008 [1.60 0.2] 0.033 0.008 [0.85 0.2] 0.035 [0.9] 0.020 0.004 [0.50 0.1] 0.024 [0.60] 0.024 0.004 [0.60 0.1] w 0.079 0.008 [2.00 0.2] 0.050 0.008 [1.25 0.2] 0.048 [1.2] 0.020 0.004 [0.50 0.1] 0.040 [1.00] 0.035 0.004 [0.90 0.1] r 0.081 0.008 [2.05 0.2] 0.053 0.008 [1.35 0.2] 0.063 [1.6] 0.020 0.004 [0.50 0.1] 0.043 [1.1] 0.035 0.004 [0.9 0.1] p 0.094 0.004 [2.4 0.1] 0.057 0.004 [1.45 0.1] 0.047 [1.2] 0.020 0.004 [0.50 0.1] 0.057 [1.40] 0.035 0.004 [0.90 0.1] a 0.126 0.008 [3.2 0.2] 0.063 0.008 [1.6 0.2] 0.071 [1.8] 0.031 0.004 [0.80 0.1] 0.063 [1.60] 0.047 0.004 [1.20 0.1] n 0.138 0.008 [3.5 0.2] 0.112 0.008 [2.8 0.2] 0.048 [1.2] 0.031 0.008 [0.80 0.2] 0.077 [1.95] 0.094 0.004 [2.4 0.1] t 0.138 0.008 [3.5 0.2] 0.112 0.008 [2.8 0.2] 0.063 [1.6] 0.031 0.008 [0.80 0.2] 0.077 [1.95] 0.094 0.004 [2.4 0.1] b 0.138 0.008 [3.5 0.2] 0.112 0.008 [2.8 0.2] 0.08 [2.0] 0.031 0.008 [0.80 0.2] 0.077 [1.95] 0.094 0.004 [2.4 0.1] l anode polarity bar anode termination h w p1 c p2 p1 cathode termination
tp8 www.vishay.com vishay sprague revision: 11-may-16 2 document number: 40151 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 ratings and case codes f 6.3 v 10 v 16 v 20 v 25 v 40 v 1.0 m m m / w r p 2.2 m 3.3 m r 4.7 m m p p 6.8 w n / b 10 m r a / r a 15 r 22 a 47 t / b 100 a marking voltage code capacitance code vcodecap, fcode 6.3 j 1.0 a 10 a 2.2 j 16 c 3.3 n 20 d 4.7 s 25 e 6.8 w 35 v 10 ? 40 g 15 e 50 t 22 j 33 n 47 s 68 w 100 a m-case voltage code a polarity bar n, t, b-case 2 vishay marking 47 10 voltage capacitance polarity bar p, r, w-case a-case capacitance code voltage code polarity bar eia capacitance code (pf) 107 j voltage code polarity bar aw
tp8 www.vishay.com vishay sprague revision: 11-may-16 3 document number: 40151 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 standard ratings capacitance (f) case code part number max. dcl at +25 c (a) max. df at +25 c 120 hz (%) max. esr at +25 c 100 khz ( ? ) max. ripple 100 khz i rms (a) 6.3 v dc at +85 c; 4 v dc at +125 c 4.7 m tp8m475m6r3c 0.50 8 6 0.06 10 m tp8m106m6r3c 0.63 8 5 0.07 100 a tp8a107(1)6r3c 6.30 30 3 0.16 10 v dc at +85 c; 7 v dc at +125 c 1.0 m tp8m105m010c 0.50 6 12 0.05 3.3 m tp8m335(1)010c 0.50 8 6 0.06 4.7 m tp8m475m010c 0.50 8 6 0.06 6.8 w tp8w685(1)010c 0.68 8 8 0.06 10 r tp8r106(1)010c 1.00 8 8 0.08 15 r tp8r156(1)010c 1.50 8 5 0.09 22 a tp8a226(1)010c 2.20 8 8 0.10 47 b tp8b476(1)010c 4.70 8 2 0.20 47 t tp8t476(1)010c 4.70 8 1 0.29 16 v dc at +85 c; 10 v dc at +125 c 1.0 m tp8m105m016c 0.50 6 12 0.05 2.2 m tp8m225m016c 0.50 10 12 0.05 10 a tp8a106(1)016c 1.60 8 6 0.11 10 r tp8r106(1)016c 1.60 8 8 0.08 20 v dc at +85 c; 13 v dc at +125 c 1.0 m tp8m105m020c 0.50 6 12 0.05 1.0 w tp8w105m020c 0.50 8 8 0.06 3.3 r tp8r335(1)020c 0.70 8 8 0.08 4.7 p tp8p475(1)020c 0.90 6 6 0.09 6.8 b tp8b685(1)020c 1.36 8 6 0.12 6.8 n tp8n685(1)020c 1.36 8 6 0.11 10 a tp8a106(1)020c 2.00 8 3 0.16 25 v dc at +85 c; 17 v dc at +125 c 1.0 r tp8r105(1)025c 0.50 6 10 0.07 4.7 p tp8p475(1)025c 1.20 6 6 0.09 40 v dc at +85 c; 28 v dc at +125 c 1.0 p tp8p105(1)040c 0.50 8 10 0.07 note ? part number definition: (1) tolerance: for 10 % tolera nce, specify k; for 20 % tolerance, change to m
tp8 www.vishay.com vishay sprague revision: 11-may-16 4 document number: 40151 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 note (1) exception: instead of sold er bath/dip and look test (j-std-002, method b at 215 c, category 3) was pe rformed method 2 - surfa ce mount process simula tion test per jesd22-b102e as specified in aec-q005 rev-a. aec-q200 qualification testing no. aec-q200 test item reference 1 pre- and post stress electrical test internal spec 3 high temperature expo sure (storage) aec-q200 4 temperature cycling aec-q200 7 biased humidity aec-q200 8 operational life aec-q200 9 external visual aec-q200 10 physical dimension aec-q200 12 resistance to solvents aec-q200 13 mechanical shock aec-q200 14 vibration aec-q200 15 resistance to soldering heat aec-q200 17 esd aec-q200 18 solderability (1) aec-q200 19 electrical characterization internal spec 22 terminal strength (smd) aec-q200 standard packaging quantity case code quantity (pcs/reel) 7" reel m 4000 w 2500 r 2500 p 3000 a 2000 n 2500 t 2500 b 2000 power dissipation case code maximum permissible power dissipation at +25 c (w) in free air m 0.025 w 0.040 r 0.045 p 0.045 a 0.075 n 0.075 t 0.084 b 0.085 product information micro guide www.vishay.com/doc?40115 moisture sensitivity www.vishay.com/doc?40135 selector guides solid tantalum selector guide www.vishay.com/doc?49053 faq frequently asked questions www.vishay.com/doc?40110
micro guide www.vishay.com vishay sprague revision: 12-sep-17 1 document number: 40115 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 guide for leadframeless molded tantalum capacitors introduction tantalum electrolytic capacitors are the preferred choice in applications where volumetric efficiency, stable electrical parameters, high reliab ility, and long service life are primary considerations. the stability and resistance to elevated temperatures of the tantalum / tantalum oxide / manganese dioxide system make solid tantalum capacitors an appropriate choice for toda ys surface mount assembly technology. vishay sprague has been a pioneer and leader in this field, producing a large variety of tantalum capacitor types for consumer, industrial, automotive, military, and aerospace electronic applications. tantalum is not found in its pure state. rather, it is commonly found in a number of oxide minerals, often in combination with columbium ore. this combination is known as tantalite when its contents are more than one-half tantalum. important sources of tantalite include australia, brazil, canada, china, an d several african countries. synthetic tantalite concentrates produced from tin slags in thailand, malaysia, and brazil are also a significant raw ma terial for tantalum production. electronic applications, an d particularly capacitors, consume the largest share of world tantalum production. other important applications for tantalum include cutting tools (tantalum carbide), high temperature super alloys, chemical processing equipment, medical implants, and military ordnance. vishay sprague is a major user of tantalum materials in the form of powder and wire for capacitor elements and rod and sheet for high temperatu re vacuum processing. the basics of tantalum capacitors most metals form crystalline oxides which are non-protecting, such as rust on iron or black oxide on copper. a few metals form dens e, stable, tightly adhering, electrically insulating oxides. these are the so-called valve metals and include titanium, zi rconium, niobium, tantalum, hafnium, and aluminum. only a few of these permit the accurate control of oxide thickness by electrochemical means. of these, the most valuable for the electronics industry are aluminum and tantalum. capacitors are basic to all kinds of electrical equipment, from radios and television sets to missile controls and automobile ignitions. their function is to store an electrical charge for later use. capacitors consist of two co nducting surfaces, usually metal plates, whose function is to conduct electricity. they are separated by an insulating material or dielectric. the dielectric used in all tantalum electrolytic capacitors is tantalum pentoxide. tantalum pentoxide compound possesses high-dielectric strength and a high-dielectric constant. as capacitors are being manufactured, a film of tantalum pentox ide is applied to their electrodes by means of an electrolytic process. the film is applied in various thic knesses and at various voltages and although transparent to begin with, it takes on different colors as light refracts through it. this coloring occurs on the tantalum electrodes of all types of tantalum capacitors. rating for rating, tantalum capacitors tend to have as much as three times better capacitance / volume efficiency than aluminum electrolytic capacitors. an approximation of the capacitance / volume efficiency of other types of capacitors may be inferred from the following table, which shows the dielectric constant ranges of the various materials used in each type. note that tantalum pentoxide has a dielectric constant of 26, some three times greater than that of aluminum oxide. this, in addition to the fact that extremely thin films can be deposited du ring the electrolytic process mentioned earlier, makes the tantalum capacitor extremely efficient with respect to the number of microfarads available per unit volume. th e capacitance of any capacitor is determined by the su rface area of the two conducting plates, the distance between the plates, and the dielectric constant of the insulating material between the plates. in the tantalum electrolytic capacitor, the distance between the plates is very small since it is only the thickness of the tantalum pentoxide film. as the dielectric constant of the tantalum pentoxide is high, the capacitance of a tantalum capacitor is high if the area of the plates is large: ? where c= capacitance e = dielectric constant a = surface area of the dielectric t = thickness of the dielectric tantalum capacitors contain either liquid or solid electrolytes. in solid electrolyte capacitors, a dry material (manganese dioxide) forms the cathode plate. a tantalum lead is embedded in or welded to the pellet, which is in turn connected to a termination or lead wire. the drawings show the construction details of the surface mount types of tantalum capacitors sh own in this catalog. comparison of capacitor dielectric constants dielectric e dielectric constant air or vacuum 1.0 paper 2.0 to 6.0 plastic 2.1 to 6.0 mineral oil 2.2 to 2.3 silicone oil 2.7 to 2.8 quartz 3.8 to 4.4 glass 4.8 to 8.0 porcelain 5.1 to 5.9 mica 5.4 to 8.7 aluminum oxide 8.4 tantalum pentoxide 26 ceramic 12 to 400k c ea t ------ - =
micro guide www.vishay.com vishay sprague revision: 12-sep-17 2 document number: 40115 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 solid electrolyte tantalum capacitors solid electrolyte capacitors contain manganese dioxide, which is formed on the tantalum pentoxide dielectric layer by impregnating the pellet with a solution of manganous nitrate. the pellet is then heated in an oven, and the manganous nitrate is converted to manganese dioxide. the pellet is next coated with graphite, followed by a layer of metallic silver, which provides a conductive surface between the pellet and the leadframe. molded chip tantalum capacitor encases the element in plastic resins, such as epoxy materials. afte r assembly, the capacitors are tested and inspected to assure long life and reliability. it offers excellent reliability and high stability for consumer and commercial el ectronics with the added feature of low cost. surface mount designs of so lid tantalum capacitors use lead frames or lead frameless designs as shown in the accompanying drawings. tantalum capacitors for all design considerations solid electrolyte designs are the least expensive for a given rating and are used in many applications where their very small size for a given unit of capacitance is of importance. they will typically withstand up to about 10 % of the rated dc working voltage in a revers e direction. also important are their good low temperature performance characteristics and freedom from corrosive electrolytes. vishay sprague patented the original solid electrolyte capacitors and was the first to market them in 1956. vishay sprague has the broadest line of tantalum capacitors and has continued its position of leadership in this field. data sheets covering the various types and styles of vishay sprague capacitors for consumer and entertainment electronics, industry, and milit ary applications are available where detailed performance characteristics must be specified. ? fig. 1 - leadframeless molded capacitors, all types s ide cathode termination (-) s intered tantalum pellet mno 2 /carbon/ s ilver coating bottom cathode termination (-) s ilver adhe s ive epoxy g la ss reinforced epoxy re s in bottom anode termination (+) s ide anode termination (+) polarity bar marking epoxy re s in encap s ulation voltage code excluding 0402 (1005 metric) ca s e s ize
micro guide www.vishay.com vishay sprague revision: 12-sep-17 3 document number: 40115 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 solid tantalum capacitors - leadframeless molded series tl8 298d 298w tr8 product image type solid tantalum leadframeless molded chip capacitors features small size including 0603 and 0402 foot print ultra low profile industrial grade industrial grade, extended range low esr temperature range operating temperature: -55 c to +125 c (above 40 c, voltage derating is required) operating temperature: -55 c to +125 c (above 85 c, voltage derating is required) operating temperature: -55 c to +125 c (above 40 c, voltage derating is required) operating temperature: -55 c to +125 c (above 85 c, voltage derating is required) capacitance range 0.68 f to 220 f 0.33 f to 220 f 2.2 f to 220 f 1 f to 220 f voltage range 4 v to 25 v 2.5 v to 50 v 4 v to 16 v 2.5 v to 25 v capacitance tolerance 20 %, 10 % dissipation factor 6 % to 80 % 6 % to 80 % 30 % to 80 % 6 % to 80 % case codes w9, a0, b0 k, m, r, p, q, a, s, b k, m, q m, r, p, q, a, b termination 100 % tin 100 % tin or gold plated solid tantalum capacitors - leadframeless molded series tp8 tm8 dla 11020 t42 product image type solid tantalum leadframeless molded chip capacitors features small size including 0603 and 0402 foot print built in fuse, double-stacked high performance, automotive grade high reliability high reliability, dla approved high reliability, ultra-low esr temperature range operating temperature: -55 c to +125 c (above 85 c, voltage derating is required) capacitance range 1 f to 100 f 0.68 f to 47 f 1 f to 47 f 10 f to 470 f voltage range 6.3 v to 40 v 2 v to 40 v 6.3 v to 40 v 16 v to 75 v capacitance tolerance 20 %, 10 % dissipation factor 6 % to 30 % 6 % to 20 % 6 % to 8 % 6 % to 15 % case codes m, w, r, p, a, n, t, b k, m, g, w, r, p, a, n, t m, w, r, p, a, n, t m2 termination 100 % tin tin / lead solder plated, 100 % tin and gold plated tin / lead solder plated or gold plated tin / lead solder plated or 100 % tin
micro guide www.vishay.com vishay sprague revision: 12-sep-17 4 document number: 40115 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 notes ? metric dimensions will govern . dimensions in inches are rounded and for reference only. (1) a 0 , b 0 , k 0 , are determined by the maximum dimensions to the ends of the terminals extending fr om the component body and / or the body dimensions of the component. the clearance between the ends of the terminals or body of the co mponent to the sides and depth of the cavity (a 0 , b 0 , k 0 ) must be within 0.002" (0.05 mm) minimum and 0.020" (0. 50 mm) maximum. the clearance allo wed must also prevent rotation of the component within the cavity of not more than 20. (2) tape with components shall pass around radius r without damage . the minimum trailer length may require additional length to p rovide r minimum for 12 mm embossed tape for reels with hub diameters approaching n minimum. (3) this dimension is the flat area from the edge of the sprocket hole to either outward deformatio n of the carrier tape between th e embossed cavities or to the edge of the cavity whichever is less. (4) this dimension is the flat area from the edge of the carrier ta pe opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cav ity or to the edge of the cavity whichever is less. (5) the embossed hole location shall be measured from the sprocket hole controlling the location of the embossement. dimensions of embossement location shall be a pplied independent of each other. (6) b 1 dimension is a reference dimension tape feeder clearance only. notes (1) for reference only (2) packaging of m case in plastic tape is available per request plastic tape and reel packaging in inches [millimeters] tape and reel specifications: all case sizes are available on plastic embo ssed tape per eia-481. standard reel diameter is 7" [178 mm]. carrier tape dimensions in inches [millimeters] for 298d, 298w, tr8, tp8, tl8 case code tape size b 1 (max.) (1) d 1 (min.) f k 0 (max.) p 1 w m (2) 8 mm 0.075 [1.91] 0.02 [0.5] 0.138 [3.5] 0.043 [1.10] 0.157 [4.0] 0.315 [8.0] w 8 mm 0.112 [2.85] 0.039 [1.0] 0.138 [3.5] 0.053 [1.35] 0.157 [4.0] 0.315 [8.0] r 8 mm 0.098 [2.46] 0.039 [1.0] 0.138 [3.5] 0.066 [1.71] 0.157 [4.0] 0.315 [8.0] p 8 mm 0.108 [2.75] 0.02 [0.5] 0.138 [3.5] 0.054 [1.37] 0.157 [4.0] 0.315 [8.0] a 8 mm 0.153 [3.90] 0.039 [1.0] 0.138 [3.5] 0.078 [2.00] 0.157 [4.0] 0.315 [8.0] a0, q 8 mm - 0.02 [0.5] 0.138 [3.5] 0.049 [1.25] 0.157 [4.0] 0.315 [8.0] b 8 mm 0.157 [4.0] 0.039 [1.0] 0.138 [3.5] 0.087[2.22] 0.157 [4.0] 0.315 [8.0] w9, s 8 mm 0.126 [3.20] 0.029 [0.75] 0.138 [3.5] 0.045 [1.15] 0.157 [4.0] 0.315 [8.0] b0 12 mm 0.181 [4.61] 0.059 [1.5] 0.217 [5.5] 0.049 [1.25] 0.157 [4.0] 0.472 [12.0] 0.004 [0.10] max. k 0 tape thickness b 1 (max.) (6) 0.014 [0.35] max. 10 pitches cumulative tolerance on tape 0.008 [0.200] embossment 0.069 0.004 [1.75 0.10] d 1 (min.) for components 0.079 x 0.047 [2.0 x 1.2] and larger (5) . maximum user direction of feed center lines of cavity a 0 p 1 f w 0.030 [0.75] min. (3) 0.030 [0.75] min. (4) 0.079 0.002 [2.0 0.05] 0.157 0.004 [4.0 0.10] 0.059 + 0.004 - 0.0 [1.5 + 0.10 - 0.0] b 0 maximum component rotation (side or front sectional view) 20 for tape feeder reference only including draft. concentric around b 0 (5) deformation between embossments to p cover tape top cover tape cavity size (1) cathode (-) anode (+) direction of feed 20 maximum component rotation typical component cavity center line typical component center line a 0 b 0 (top view) 0.9843 [250.0] tape 3.937 [100.0] 0.039 [1.0] max. 0.039 [1.0] max. camber allowable camber to be 0.039/3.937 [1/100] (top view) non-cumulative over 9.843 [250.0]
micro guide www.vishay.com vishay sprague revision: 12-sep-17 5 document number: 40115 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 notes (1) for reference only note (1) for reference only note (1) a 0 , b 0 are determined by the maximum dimensions to the ends of the terminals e xtending from the component body and / or the body dimensions of the component. the clearance between the ends of the terminals or body of the co mponent to the sides and depth of the cavity (a 0 , b 0 ) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. the clearan ce allowed must also prevent rotation of the component within the ca vity of not more than 20. carrier tape dimensions in inches [millimeters] for tm8 case code tape size b 1 (max.) (1) d 1 (min.) f k 0 (max.) p 1 w m 8 mm 0.075 [1.91] 0.02 [0.5] 0.138 [3.5] 0.043 [1.10] 0.157 [4.0] 0.315 [8.0] g 8 mm 0.077 [1.96] 0.02 [0.5] 0.138 [3.5] 0.051 [1.30] 0.157 [4.0] 0.315 [8.0] w 8 mm 0.112 [2.85] 0.039 [1.0] 0.138 [3.5] 0.053 [1.35] 0.157 [4.0] 0.315 [8.0] r 8 mm 0.098 [2.46] 0.039 [1.0] 0.138 [3.5] 0.066 [1.71] 0.157 [4.0] 0.315 [8.0] p 8 mm 0.108 [2.75] 0.02 [0.5] 0.138 [3.5] 0.054 [1.37] 0.157 [4.0] 0.315 [8.0] a 8 mm 0.153 [3.90] 0.039 [1.0] 0.138 [3.5] 0.078 [2.00] 0.157 [4.0] 0.315 [8.0] n 12 mm 0.154 [3.90] 0.059 [1.5] 0.216 [5.5] 0.051 [1.30] 0.157 [4.0] 0.472 [12.0] t 12 mm 0.154 [3.90] 0.059 [1.5] 0.216 [5.5] 0.067 [1.70] 0.157 [4.0] 0.472 [12.0] carrier tape dimensions in inches [millimeters] for t42 case code tape size b 1 (max.) (1) d 1 (min.) f k 0 (max.) p 1 w m2 16 mm 0.404 [10.3] 0.059 [1.5] 0.295 [7.5] 0.176 [4.5] 0.472 [12.0] 0.630 [16.0] paper tape and reel packaging in inches [millimeters] ? for 298d, 298w, tr8, tp8, tl8, tm8 (k case only) case size tape size a 0 b 0 d 0 p 0 p 1 p 2 efwt k8 mm 0.033 0.002 [0.85 0.05] 0.053 0.002 [1.35 0.05] 0.06 0.004 [1.5 0.1] 0.157 0.004 [4.0 0.1] 0.078 0.004 [2.0 0.1] 0.079 0.002 [2.0 0.05] 0.069 0.004 [1.75 0.1] 0.0138 0.002 [3.5 0.05] 0.315 0.008 [8.0 0.2] 0.03 0.002 [0.75 0.05] m8 mm 0.041 0.002 [1.05 0.05] 0.071 0.002 [1.8 0.05] 0.06 0.004 [1.5 0.1] 0.157 0.004 [4.0 0.1] 0.157 0.004 [4.0 0.1] 0.079 0.002 [2.0 0.05] 0.069 0.004 [1.75 0.1] 0.0138 0.002 [3.5 0.05] 0.315 0.008 [8.0 0.2] 0.037 0.002 [0.95 0.05] ? d 0 t bottom cover tape f p 1 a 0 b 0 e 2 p 2 w p 0 e 1 cavity s ize (1) bottom cover tape u s er feed direction cavity center line s top cover tape [10 pitche s cumulative tolerance on tape 0.2 mm] g anode
micro guide www.vishay.com vishay sprague revision: 12-sep-17 6 document number: 40115 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 recommended reflow profiles capacitors should withstand reflow profile as per j-std-020 standard, three cycles. profile feature snpb eutectic assembly lead (pb)-free assembly preheat and soak temperature min. (t smin. ) 100 c 150 c temperature max. (t smax. ) 150 c 200 c time (t s ) from (t smin. to t smax. ) 60 s to 90 s 60 s to 150 s ramp up ramp-up rate (t l to t p ) 3 c/s maximum liquidus temperature (t l ) 183 c 217 c time (t l ) maintained above t l 60 s to 150 s peak package body temperature (t p ) max. 235 c 260 c time (t p ) within 5 c of the peak max. temperature 20 s 30 s ramp down ramp-down rate (t p to t l ) 6 c/s maximum time from 25 c to peak temper ature 6 min maximum 8 min maximum pad dimensions in inches [millimeters] case code a (nom.) b (min.) c (nom.) d (min.) k 0.021 [0.53] 0.016 [0.41] 0.022 [0.55] 0.054 [1.37] m, g 0.024 [0.61] 0.027 [0.70] 0.025 [0.64] 0.080 [2.03] r, w9, s 0.035 [0.89] 0.029 [0.74] 0.041 [1.05] 0.099 [2.52] w 0.035 [0.89] 0.029 [0.74] 0.037 [0.95] 0.095 [2.41] p 0.035 [0.89] 0.029 [0.74] 0.054 [1.37] 0.112 [2.84] a, q, a0 0.047 [1.19] 0.042 [1.06] 0.065 [1.65] 0.148 [3.76] b, b0 0.094 [2.39] 0.044 [1.11] 0.072 [1.82] 0.159 [4.03] n, t 0.094 [2.39] 0.044 [1.11] 0.065 [1.65] 0.152 [3.86] m2 0.315 [8.00] 0.098 [2.50] 0.197 [5.00] 0.394 [10.0] time temperature t s time 25 c to peak t p t p t l t smin. 25 t l t smax. preheat area max. ramp up rate = 3 c/s max. ramp down rate = 6 c/s a b c d
micro guide www.vishay.com vishay sprague revision: 12-sep-17 7 document number: 40115 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 notes ? at +25 c , the leakage current shall not exceed the value listed in the standard ratings table ? at +85 c , the leakage current shall not exceed 10 times the value listed in the standard ratings table ? at +125 c , the leakage current shall not exceed 12 times the value listed in the standard ratings table typical leakag e current factor range typical curves at +25 c, impedance and esr vs. frequency 100 10 1.0 0.1 0.01 0.001 010 40 708090 60 50 20 30 100 + 125 c + 85 c + 55 c + 25 c 0 c - 55 c percent of rated volta g e leaka g e current factor 1 10 100 0.1 1 10 100 1000 fre q uency, khz m ca s e 22 f - 4 v impedance e s r e s r/z, 0.1 1 10 100 0.1 1 10 100 1000 fre q uency, khz e s r/z, m ca s e 47 f - 4 v impedance e s r 1 10 100 1000 0.1 1 10 100 1000 fre q uency, khz e s r/z, m ca s e 10 f - 6 v impedance e s r 0.1 1 10 100 1000 0.1 1 10 100 1000 fre q uency, khz e s r/z, m ca s e 4.7 f - 10 v impedance e s r
micro guide www.vishay.com vishay sprague revision: 12-sep-17 8 document number: 40115 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 typical curves at +25 c, impedance and esr vs. frequency 1 10 100 1000 0.1 1 10 100 1000 fre q uency, khz e s r/z, m ca s e 10 f - 10 v impedance e s r 1 10 100 1000 10 000 0.1 1 10 100 1000 fre q uency, khz e s r/z, m ca s e 1 f - 16 v impedance e s r 100.0 10.0 1.0 0.1 e s r/z, 0.1 1 10 100 1000 33 f - 10 v impedance e s r p ca s e fre q uency, khz 1000.0 100.0 10.0 1.0 0.1 0.1 1 10 100 1000 impedance e s r fre q uency, khz e s r/z, p ca s e 4.7 f - 25 v 100.0 1.0 10.0 0.1 0.1 1 10 100 1000 e s r/z, fre q uency, khz p ca s e impedance e s r 47 f - 10 v 10.0 1.0 0.1 0.1 1 10 100 1000 e s r/z, fre q uency, khz p ca s e 220 f - 4 v impedance e s r
micro guide www.vishay.com vishay sprague revision: 12-sep-17 9 document number: 40115 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 guide to application 1. ac ripple current: the maximum allowable ripple current shall be determi ned from the formula: where, p = power dissipation in watts at +25 c (see paragraph number 5 and the table power dissipation as given in the tables in the product datasheets) r esr = the capacitor equivalent series resistance at the specified frequency 2. ac ripple voltage: the maximum allowable ripple voltage shall be determi ned from the formula: or, from the formula: where, p = power dissipation in watts at +25 c (see paragraph number 5 and the table power dissipation as given in the tables in the product datasheets) r esr = the capacitor equivalent series resistance at the specified frequency z = the capacitor impedance at the specified frequency 2.1 the sum of the peak ac voltage plus the applied dc voltage shall not exceed the dc voltage rating of the capacitor. 2.2 the sum of the negative peak ac voltage plus the applied dc voltage shall not allow a voltage reversal exceeding 10 % of the dc working voltage at +25 c. 3. reverse voltage: these capacitors are capable of withstanding peak voltages in the reverse direction equal to 10 % of the dc rating at +25 c, 5 % of the dc rating at +25 c, 5 % of the dc rating at +85 c, and 1 % of the dc rating at +125 c. 4. temperature derating: if these capacitors are to be operated at temperatures above +25 c, the permissible rms ripple curre nt shall be calculated using the derating factors as shown: 5. power dissipation: power dissipation will be affected by the heat sinking capability of the mounting surface. non-sinusoidal ripple current may produce heating effects which differ from those shown. it is important that the equivalent i rms value be established when calculating permissible operating levels. (power di ssipation calculated using +25 c temperature rise.) 6. printed circuit board materials: molded capacitors are compatible with commonly used printed circuit board materials (alumina su bstrates, fr4, fr5, g10, ptfe-fluorocarbon and porcelanized steel). 7. attachment: 7.1 solder paste: the recommended thickness of the solder paste after applic ation is 0.007" 0.001" [0.178 mm 0.025 mm]. care should be exercised in selecting the solder paste. the metal purity should be as high as practical. the flux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. in practice this can be aide d by extending the solder preheat time at temperatu res below the liquidous state of the solder. 7.2 soldering: capacitors can be attached by conventional soldering techniques; vapor phase, convection reflow, infrared reflow, wave soldering and hot plate methods. the soldering profile charts show recommended time / temperature conditions for soldering. preheating is recommended. the recommended maximum ramp rate is 2 c per s. attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at temperature. the soldering iron must never come in contact with the capacitor. 7.2.1 backward and forward compatibility: capacitors with snpb or 100 % tin termination finishes can be soldered using snpb or lead (pb)-free soldering processes. 8. cleaning (flux removal) after soldering: molded capacitors are compatible with all commonly used solvents such as tes, tms, prelete, chlorethane, terpene and aqueous clea ning media. however, cfc / ods products are not used in the production of these devices and are not recommended. solvents containing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material. 8.1 when using ultrasonic cleaning, the board may resonate if the output power is too high. this vibration can cause cracking or a decrease in the adherence of the termination. do not exceed 9w/l at 40 khz for 2 min. 9. recommended mounting pad geometries: proper mounting pad geometries are essential for successful solder connections. these dimensions are highly process sensitive and should be designed to minimize component re work due to unacceptable solder joints. the dimensional configurations shown are the recommended pad geometries for both wave and reflow soldering techniques. these dimensions are intended to be a starting point for circuit board designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and / or circuit board design. temperature derating factor +25 c 1.0 +85 c 0.9 +125 c 0.4 i rms p r esr ------------ = v rms z p r esr ------------ = v rms i rms x z =
typical performance characteristics www.vishay.com vishay sprague revision: 26-jun-17 1 document number: 40215 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 molded chip tantalum capacitors, automotive grade notes ? all information presented in this document reflects typical performance characteristics (1) series th3 - up to 150 c; th4 - up to 175 c (2) capacitance value 15 f and higher (3) for 293d and tr3 only note ? for temperatures above +85 c the same voltage derating ratio is recommended, but with respect to category voltage. up to +85 c: category voltage = rated voltage at +125 c: category volt age = 2/3 of rated voltage at 150 c / 175 c: category vo ltage = 1/2 of rated voltage electrical performance characteristics item performance characteristics category temperature range -55 c to +85 c (to +125 c / +150 c / +175 c with voltage derating - refer to graph category voltage vs. temperature) (1) capacitance tole rance 20 %, 10 %, tested via bridge method, at 25 c, 120 hz dissipation factor limits per stan dard ratings table. tested via bridge method, at 25 c, 120 hz esr limits per standard rating s table. tested via bridge method, at 25 c, 100 khz leakage current after application of rated voltage applied to capacitors for 5 min using a steady source of power with 1 k resistor in series with the capacitor under test, leakag e current at 25 c is not mo re than 0.01 cv or 0.5 a, whichever is greater. note that the leakage current varies with temperature and applied voltage. see graph typical leakage current temperature factor for the appropriate adjustment factor. capacitance change by temperature +30 % max. (at +175 c) +20 % max. (at +125 c and +150 c) +10 % max. (at +85 c) -10 % max. (at -55 c) reverse voltage capacitors are capable of withstanding peak voltages in the reverse direction equal to: 10 % of the dc rating at +25 c 5 % of the dc rating at +85 c 1 % of the dc rating at +125 c ripple current for maximum ripple current values (at 25 c) refer to relevant datasheet. if capacitors are to be used at temperatures above +25 c, the permissible rms ripple current (or voltage) shall be calculated using the derating factors: 1.0 at +25 c 0.9 at +85 c 0.4 at +125 c 0.3 at +150 c 0.2 at +175 c maximum operating and surge voltages vs. temperature +85 c +125 c +150 c / +175 c rated voltage (v) surge voltage (v) category voltage (v) surge voltage (v) category voltage (v) 4 5.2 2.7 3.4 n/a 6.38453 10 13 7 8 5 16 20 10 12 8 20 26 13 16 10 25 32 17 20 12.5 35 46 23 28 17.5 50 65 33 40 25 50 (2) 60 33 40 n/a 63 75 42 50 n/a 75 (3) 75 50 50 n/a recommended voltage de rating guidelines (for temperature below +85 c) voltage rail capacitor voltage rating 3.3 6.3 510 10 20 12 25 15 35 24 50 or series configuration
typical performance characteristics www.vishay.com vishay sprague revision: 26-jun-17 2 document number: 40215 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 note ? below 85 c category voltage is equal to rated voltage note ? at +25 c , the leakage current shall not exceed the value listed in the standard ratings table. at +85 c , the leakage current shall not exceed 10 times the value listed in the standard ratings table. at +125 c , the leakage current shall not exceed 12 times the value listed in the standard ratings table. at +150 c , the leakage current shall not exceed 15 times the value listed in the standard ratings table. at +175 c , the leakage current shall not exceed 18 times the value listed in the standard ratings table category voltage vs. temperature typical leakage current factor category voltage (v) temperature (c) 1.0 0.8 0.6 0.4 0.2 0 -55 0 25 85 125 150 175 voltage-temperature derating coefficient leakage current factor percent of rated voltage 100 10 1 0.1 0.01 0.001 0 102030405060708090100 +125 c +85 c +55 c +25 c - 55 c +150 c +175 c 0 c
typical performance characteristics www.vishay.com vishay sprague revision: 26-jun-17 3 document number: 40215 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 environmental performance characteristics item condition post test performance high temperature exposure (storage) mil-std-202, method 108 1000 h, at maximum rated temperature, unpowered capacitance change dissipation factor leakage current esr within 20 % of initial value initial specified limit initial specified limit initial specified limit operational life test at +125 c aec-q200 1000 h application 2/3 of rated voltage capacitance change dissipation factor leakage current esr within 20 % of initial value initial specified limit shall not exceed 10 times the initial limit initial specified limit operational life test at +150 c (for th3) and at +175 c (for th4) aec-q200 1000 h application 1/2 of rated voltage capacitance change dissipation factor leakage current esr within 20 % of initial value shall not exceed 3 times the initial limit shall not exceed 10 times the initial limit shall not exceed 3 times the initial limit surge voltage mil-prf-55365: 1000 successive test cycl es at 85 c of surge voltage (as specified in the table above), in series with a 33 resistor at the rate of 30 s on, 30 s off capacitance change dissipation factor leakage current esr within 30 % of initial value shall not exceed 1.5 times the initial limit shall not exceed 2 times the initial limit shall not exceed 1.5 times the initial limit biased humidity test aec-q200 at 85 c / 85 % rh, 1000 h, with rated voltage applied capacitance change dissipation factor leakage current esr within 20 % of initial value shall not exceed 3 times the initial limit shall not exceed 10 times the initial limit shall not exceed 3 times the initial limit temperature cycling aec-q200 / jesd22, method ja-104 -55 c / +125 c, for 1000 cycles capacitance change dissipation factor leakage current esr within 20 % of initial value initial specified limit initial specified limit initial specified limit mechanical performance characteristics item condition post test performance vibration mil-std-202, method 204: 10 hz to 2000 hz, 5 g peak for 20 min, 12 cycles each of 3 orientations (total 36 cycles), at rated voltage capacitance change dissipation factor leakage current within 20 % of initial value initial specified limit initial specified limit there shall be no mechanical or visual damage to capacitors post-conditioning. mechanical shock mil-std-202, method 213, condition f, 1500 g peak, 0.5 ms, half-sine capacitance change dissipation factor leakage current within 20 % of initial value initial specified limit initial specified limit there shall be no mechanical or visual damage to capacitors post-conditioning. resistance to solder heat mil-std-202, method 210, condition d solder dip 260 c 5 c, 10 s capacitance change dissipation factor leakage current within 20 % of initial value initial specified limit initial specified limit resistance to solvents mil-std-202, method 215 capacitance change dissipation factor leakage current within 20 % of initial value initial specified limit initial specified limit there shall be no mechanical or visual damage to capacitors post-conditioning. body marking shall remain legible. solderability aec-q200 / j-std-002 electrical test not required terminal strength / shear force test aec-q200-006 apply a pressure load of 17.7 n (1.8 kg) for 60 s horizontally to the cente r of capacitor side body exception: for case size 0603 pressure load is 5n part should not be sheared off the pads and no body cracking post-conditioning. el ectrical test not required. flammability encapsulation materi als meet ul 94 v-0 with an oxygen index of 32 % n/a
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